Ensuring that this enhanced within-chip etch precision extends across the entire wafer, the Centris Sym3 system has been comprehensively redesigned for True Symmetry™ of power, gas delivery, and thermal characteristics necessary. In addition, improvements to Pulsync™ increase the effectiveness of synchronized plasma pulsing to minimize pattern loading. Users can enhance further performance with optional dual frequency bias that facilitates the etching of challenging high aspect ratio features.
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On February 26, 2019, at the next conference day of the « Rencontres de génie, Genium 360 », several experts and entrepreneurs will gather to present how the 4th industrial revolution is reinventing business models. Catherine Bouchard, president of Centris Technologies, will present at 10:45 the conference “Implementation of a vertical integration system: comparison of impacts on …
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