The redesigned Sym3 chamber environment makes possible process control to within a few atomic layers within chip, chip to chip, and wafer to wafer. The Centris platform delivers the excellent repeatability and high productivity demanded for high-volume manufacturing through system intelligence software that ensures exact process matching among the six etch chambers and between the two plasma clean chambers mounted on the platform.

Les informations des propriétés sur ce site proviennent des inscriptions Royal LePage et du service de distribution de données de l'Association canadienne de l’immeuble (SDD). SDD mets en référence des inscriptions tenues par des agences immobilières autres que Royal LePage et ses distributeurs. L'exactitude de l'information n'est pas garantie et devrait être indépendamment vérifiée.

Ensuring that this enhanced within-chip etch precision extends across the entire wafer, the Centris Sym3 system has been comprehensively redesigned for True Symmetry™ of power, gas delivery, and thermal characteristics necessary. In addition, improvements to Pulsync™ increase the effectiveness of synchronized plasma pulsing to minimize pattern loading. Users can enhance further performance with optional dual frequency bias that facilitates the etching of challenging high aspect ratio features.
On February 26, 2019, at the next conference day of the « Rencontres de génie, Genium 360 », several experts and entrepreneurs will gather to present how the 4th industrial revolution is reinventing business models. Catherine Bouchard, president of Centris Technologies, will present at 10:45 the conference “Implementation of a vertical integration system: comparison of impacts on …
×