At earlier technology nodes, when features were larger, a greater range in variation in etch depth, line or space width, or profile angle could be accommodated without affecting device performance. Similarly, occasional particles remaining on feature surfaces did not jeopardize device reliability. At the 1x/10nm node, however, the slightest differences in etch depth, line or space width, or profile angle can be fatal flaws in chip manufacture. And defect-free surfaces are equally essential.
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DuProprio’s March campaign features decorator to the stars Marie-Christine Lavoie getting ready to sell the Quebec City-area home she owns with her husband, former Habs defenseman Mathieu Dandenault. DuProprio, which operates under the ComFree banner in the rest of Canada, has been eating into brokers’ turf, capturing about 30 per cent of the Quebec City real estate market.

As semiconductor scaling has continued, increasingly rigorous requirements for precision and uniformity in chip fabrication have propelled the first comprehensive redesign of the silicon etch chamber in over a decade. The resulting Applied Centris Sym3 system delivers world-class cross-wafer uniformity with unprecedented within-chip feature control in critical etch applications for high-volume manufacturing at the 1x/10nm node and beyond.

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